# US 2015/0311135 A1 · Semiconductor device and electronic device

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- Number: US 2015/0311135 A1
- Document ID: US20150311135A1
- Status: Published application
- Kind: A1
- Application number: 14/672,729
- Filed: 2015-03-30
- Published: 2015-10-29
- Earliest claimed: 2014-04-23
- Assignees: Fujitsu Limited
- Applicants: Fujitsu Limited
- Inventors: Shinichiro Uekusa
- Web page: https://patentgrep.com/patent/US20150311135A1

## CPC

- H10W 40/10: Arrangements for heating
- H05K 1/0212: {Printed circuits or mounted components having integral heating means}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/181: associated with surface mounted components
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/10219: Thermoelectric component
- H10W 40/43: by flowing gases, e.g. forced air cooling
- H10W 70/655: Fan-out layouts
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A semiconductor device includes: a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.

## Claims

### Claim 1

A semiconductor device comprising:
a substrate;
a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and
a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein
the heating unit locally generates heat in the four corners within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.

### Claim 3 (depends on 1)

The semiconductor device according to claim 1, further comprising:
a monitoring unit for monitoring a drive rate of the semiconductor chip,
wherein the heating unit generates heat in response to a control signal from the monitoring unit.

### Claim 4 (depends on 3)

The semiconductor device according to claim 3, wherein
the monitoring unit and the heating unit are configured by logical circuits formed over the semiconductor chip.

### Claim 5

An electronic device comprising:
a semiconductor device having:
a substrate;
a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and
a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.