Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
AssigneeIntel Corporation
InventorSivakumar Nagarajan
Life of this patent
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Abstract
Embodiments of the present disclosure are directed toward underfill material including block copolymer. In one embodiment, an underfill material includes epoxy material and a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.
Claims20
An underfill material comprising:
- epoxy material;
- and
- a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.
An integrated circuit (IC) assembly comprising:
- a package substrate;
- a die coupled with the package substrate;
- and
- an underfill material disposed between the die and the package substrate, the underfill material including:
- epoxy material, and
- a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.
A method comprising:
- providing an underfill material comprising:
- epoxy material, and
- a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material and the epoxy-phobic block is covalently bonded with the epoxy-philic block;
- depositing the underfill material between a package substrate and a die coupled with the package substrate;
- and
- curing the underfill material, wherein the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.
Dependencies are inferred from the claim text.