Scribe line structure and method of forming same

A method comprising:

• patterning a first portion of a scribe line in a first polymer layer;
• forming a redistribution line (RDL) over the first polymer layer;
• forming a second polymer layer over the RDL and the first polymer layer;
• and
• patterning a second portion of the scribe line in the second polymer layer, wherein the first and the second portions are connected, and wherein the second portion of the scribe line is wider than the first portion of the scribe line.

A method comprising:

• forming a first polymer layer over a first die and a second die;
• patterning first opening extending through the first polymer layer, wherein the first opening is aligned with an area between the first die and the second die;
• forming a second polymer layer over the first polymer layer, wherein the second polymer layer is thicker than the first polymer layer;
• and
• patterning a second opening extending through the second polymer layer, wherein the second opening is connected to the first opening.

A method comprising:

• providing a first die, a second die, and a molding compound disposed between the first die and the second die;
• forming a first polymer layer over the first die and the second die;
• patterning a first opening in the first polymer layer using a photolithography process, wherein the first opening is disposed directly over the molding compound;
• after patterning the first opening, curing the first polymer layer;
• forming a second polymer layer over the first polymer layer;
• patterning a second opening in the second polymer layer, wherein the second opening is connected to the first opening, and wherein sidewalls of the second opening are spaced apart from sidewalls of the first opening;
• and
• separating the first die from the second die along a scribe line defined by the first opening and the second opening.