Method and system for aligning and orienting dies

A precision die-attach system for aligning and orienting dies to be mounted on a mounting surface, the system comprising:

• a precision-etched interposer, the precision-etched interposer comprising:
• an etched first precision-alignment receptacle having a bottom and at least first and second precision-etched side walls, wherein the first and second precision-etched side walls form a first alignment/orientation feature in the first receptacle, the first alignment/orientation feature having a precise shape and size for mating with first and second sides of a first integrated circuit (IC) die;
• and
• an etched second precision-alignment receptacle having a bottom and at least third and fourth precision-etched side walls, wherein the third and fourth precision-etched side walls form a second alignment/orientation feature in the second receptacle, the second alignment/orientation feature having a precise shape and size for mating with first and second side walls of a second IC die, wherein the first and second receptacles are integrally formed in an etched material, and wherein mating of the first and second sides of the first and second IC dies with the first and second alignment/orientation features of the first and second receptacles, respectively, precisely aligns and orients the first and second IC dies with the first and second receptacles, respectively, and with one another, and wherein the precision die-attach system is configured to place the interposer having the first and second IC dies aligned and oriented with the first and second receptacles, respectively, onto a mounting surface while maintaining the precise alignment and orientation of the first and second IC dies with the first and second receptacles, respectively.

A method for performing precision die attachment of integrated circuit (IC) dies on a mounting surface, the method comprising:

• providing a first precision-alignment receptacle having a bottom and at least first and second precision-formed side walls, wherein the first and second precision-formed side walls form a first alignment/orientation feature in the first receptacle, the first alignment/orientation feature having a precise shape and size for mating with first and second side walls of a first IC die;
• providing a second precision-alignment receptacle having a bottom and at least third and fourth precision-formed side walls, wherein the third and fourth precision-formed side walls form a second alignment/orientation feature in the second receptacle, the second alignment/orientation feature having a precise shape and size for mating with first and second side walls of a second IC die, wherein the first and second receptacles are integrally formed in an etched material;
• aligning and orienting the first and second side walls of the first and second IC dies with the first and second alignment/orientation features of the first and second receptacles, respectively, wherein aligning and orienting the first and second side walls of the first and second dies with the first and second alignment/orientation features, respectively, precisely aligns and orients the first and second IC dies with the first and second receptacles, respectively, and with one another;
• and
• placing the first and second IC dies onto a mounting surface while maintaining the precise alignment and orientation of the first and second IC dies with one another.

A method for performing precision die attachment of integrated circuit (IC) dies on a mounting surface, the method comprising:

• providing a precision-etched interposer, the precision-etched interposer having first and second precision-alignment receptacles formed therein, the first precision-alignment receptacle having a bottom and at least first and second precision-etched side walls, wherein the first and second precision-etched side walls intersect to form a first corner in the receptacle, the first corner having a precise shape and size for mating with a precisely shaped and sized corner of a first IC die, the second precision-etched receptacle having a bottom and at least third and fourth precision-etched side walls, wherein the third and fourth precision-etched side walls intersect to form a second corner in the second receptacle, the second corner having a precise shape and size for mating with a precisely shaped and sized corner of a second IC die;
• aligning and orienting the first and second IC dies with the first and second corners of the first and second receptacles, respectively, and fixedly securing the first and second IC dies in the respective aligned and oriented positions, wherein aligning and orienting the first and second dies with the first and second corners, respectively, precisely aligns and orients the first and second IC dies with the first and second receptacles, respectively, and with one another;
• and
• aligning and orienting the interposer with a mounting surface and placing the interposer on the mounting surface while maintaining the alignment and orientation of the interposer with the mounting surface.