Polishing apparatus and polishing method
AssigneeEbara Corporation
InventorsHiroshi YOSHIDA, Makoto FUKUSHIMA, Hozumi YASUDA
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Abstract
A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.
Claims26
A polishing apparatus comprising:
- a plurality of polishing tables each for supporting a polishing pad;
- a plurality of polishing heads each configured to press a substrate against the polishing pad, the plurality of polishing heads having different structures;
- and
- a transporting device configured to transport the substrate to at least two of the plurality of polishing heads.
A polishing apparatus comprising:
- a plurality of polishing tables each for supporting a polishing pad;
- a first polishing head having a plurality of pressure chambers each configured to generate a pressure for pressing a substrate against the polishing pad;
- and
- a second polishing head having a plurality of pressure chambers each configured to generate a pressure for pressing the substrate against the polishing pad, an arrangement of the pressure chambers of the second polishing head being different from an arrangement of the pressure chambers of the first polishing head.
A polishing method comprising:
- pressing a substrate against a polishing pad by a first polishing head having a plurality of pressure chambers to polish the substrate;
- and then
- pressing the substrate against a polishing pad by a second polishing head having a plurality of pressure chambers, whose arrangement is different from an arrangement of the pressure chambers of the first polishing head, to polish the substrate.
A polishing apparatus for polishing a substrate, comprising:
- a first polishing head configured to press a substrate against a first polishing surface to polish a surface of the substrate, the first polishing head having a first elastic membrane which receives a pressure of a fluid to press the substrate against the first polishing surface;
- and
- a second polishing head configured to press a substrate against a second polishing surface to polish a surface of the substrate, the second polishing head having a second elastic membrane which receives a pressure of a fluid to press the substrate against the second polishing surface, and the second elastic membrane having a structure different from that of the first elastic membrane.
A polishing apparatus for polishing a substrate, comprising:
- a first polishing head configured to press a substrate against a first polishing surface to polish a surface of the substrate, the first polishing head having a first retainer ring disposed so as to surround the substrate and configured to press the first polishing surface;
- and
- a second polishing head configured to press a substrate against a second polishing surface to polish a surface of the substrate, the second polishing head having a second retainer ring disposed so as to surround the substrate and configured to press the second polishing surface, and the second retainer ring having a structure different from that of the first retainer ring.
Dependencies are inferred from the claim text.