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US 2015/0311093 A1Published application
Method for Polishing a Polymer Surface
AssigneeNational Center for Advanced Packaging Co., Ltd.
InventorsTing LI, Haiyang GU
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Abstract
A method for polishing a polymer surface is provided by an embodiment of the present invention. The method includes: curing the polymer surface; polishing the polymer surface cured through a CMP process. By using the method for polishing a polymer surface provided by embodiments of the present invention, the mentioned problems in the prior art are solved. The uniformity of the polymer surface can be improved to <1% through a CMP process, which can meet the requirements of high density and small linewidth integration.
Claims20
A method for polishing a polymer surface, comprising:
- curing the polymer surface;
- polishing the polymer surface cured through a CMP process.
Dependencies are inferred from the claim text.