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US 2015/0311043 A1Published application
Chamber component with fluorinated thin film coating
AssigneeApplied Materials, Inc.
InventorsJennifer Y. Sun, Vahid Firouzdor, Biraja P. Kanungo, Dmitry Lubomirsky, Sung Je Kim
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Abstract
A chamber component comprises a body and a fluorinated thin film protective layer over at least one surface of the body. The fluorinated thin film protective layer does not react with process gasses having Fluorine based chemistry. The fluorinated thin film protective layer may be a YF3 layer.
Claims20
A chamber component of an etch reactor comprising:
- a body;
- and
- a fluorinated thin film protective layer over at least one surface of the body, wherein the fluorinated thin film protective layer does not react with process gasses having a Fluorine based chemistry.
A method comprising:
- providing a chamber component;
- and
- performing ion assisted deposition (IAD) to deposit a fluorinated thin film protective layer on at least one surface of the chamber component, wherein the fluorinated thin film protective layer does not react with process gasses having a Fluorine based chemistry.
A chamber component for a processing chamber prepared by a process comprising:
- performing ion assisted deposition (IAD) to deposit a fluorinated thin film protective layer on at least one surface of the chamber component, the fluorinated thin film protective layer thin film having a thickness of less than approximately 50 microns and comprising YF3.
Dependencies are inferred from the claim text.