Lc composite component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKuniaki Yosui, Takahiro Baba, Wataru Tamura
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Abstract
Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.
Claims17
An LC composite component comprising:
- a multi-layer substrate configured such that a plurality of insulating layers are stacked;
- a first pattern coil forming a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and including a conductor disposed between the plurality of insulating layers;
- and
- a chip capacitive element including a dielectric body having a relative permittivity higher than that of the insulating layers and counter electrodes that face against each other with the dielectric body interposed between the counter electrodes,
- wherein at least a part of the chip capacitive element is disposed within the first pattern coil.
Dependencies are inferred from the claim text.