Resistance assembly for mobile device and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJea-Hoon LEE, Woo-Jin CHOI, Young-Key KIM
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Abstract
A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.
Claims7
A resistance assembly for a mobile device, comprising:
- a substrate having a circuit formed thereon;
- first to third pads laminated and separated from one another on the substrate;
- first to third terminals connected to the first to third pads, respectively;
- and
- first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.
A method of manufacturing a resistance assembly for a mobile device, the method comprising:
- forming integrally-structured first and second resistors;
- forming first to third terminals separated from one another and covering either end and a middle portion, respectively, of the integrally-structured first and second resistors;
- and
- connecting the first to third terminals to first to third pads, respectively, the first to third pads being laminated and separated from one another on a substrate having a circuit formed thereon.
Dependencies are inferred from the claim text.