Making multi-layer micro-wire structure
AssigneeEastman Kodak Company
InventorsTodd Mathew Spath, Ronald Steven Cok
Life of this patent
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Abstract
A method of making a multi-layer micro-wire structure resistant to cracking on a substrate having a surface including forming a plurality of micro-channels in the substrate, locating a first electrically conductive material composition forming a first layer in each micro-channel, and locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel and in electrical contact with the first electrically conductive material composition thereby providing an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking.
Claims20
A method of making a multi-layer micro-wire structure resistant to cracking on a substrate having a surface, comprising:
- forming a plurality of micro-channels in the substrate;
- locating a first electrically conductive material composition forming a first layer in each micro-channel;
- and
- locating a second electrically conductive material composition having a greater tensile ductility than the first material composition to form a second layer in each micro-channel and in electrical contact with the first electrically conductive material composition thereby providing an electrically conductive multi-layer micro-wire in each micro-channel that is resistant to cracking.
Dependencies are inferred from the claim text.