Ic card

An integrated circuit card comprising:

• a substrate and an integrated circuit incorporated on the substrate, said substrate comprising
• a first sector delimited by a first weakening line on said substrate, said first sector being able to be separated from said substrate, and having a form and size of a first standard format,
• a second sector delimited by a second weakening line inside said first sector, said second sector being able to be separated from said substrate and having said integrated circuit thereon, and having a form and size of a second standard format having dimensions smaller than those of the first standard format,
• a disposable frame-piece defined between the first and second weakening lines of said first and second sectors, and having a ring form with a rectangular contour, with opposite sides, in pairs substantially parallel to each other, and
• at least one breakage lug arranged transversely with respect to at least one of the sides of said disposable frame-piece, said at least one breakage lug being able to break said disposable frame-piece so that it is no longer intact, during separation of said second sector from said substrate.

An integrated circuit card comprising:

• a substrate and an integrated circuit on the substrate, said substrate comprising
• a first sector delimited by a first weakening line on said substrate, said first sector being able to be separated from said substrate,
• a second sector delimited by a second weakening line inside said first sector, said second sector being able to be separated from said substrate and having said integrated circuit thereon, and having dimensions smaller than those of said first sector,
• a disposable frame-piece defined between the first and second weakening lines of said first and second sectors, and having a ring form with a rectangular contour, and
• at least one breakage lug arranged with respect to said disposable frame-piece, said at least one breakage lug being able to break said disposable frame-piece so that it is no longer intact, during separation of said second sector from said substrate.

A method for manufacturing an integrated circuit card comprising a substrate and an integrated circuit incorporated in the substrate, the method comprising:

• forming a first sector delimited by a first weakening line on the substrate, the first sector being able to be separated from the substrate, and having a form and size of a first standard format;
• forming a second sector delimited by a second weakening line inside the first sector, the second sector being able to be separated from the substrate and having the integrated circuit thereon, and having a form and size of a second standard format having dimensions smaller than those of the first standard format;
• forming a disposable frame-piece defined between the first and second weakening lines of the first and second sectors, and having a ring form with a rectangular contour, with opposite sides, in pairs substantially parallel to each other and;
• forming at least one breakage lug arranged transversely with respect to at least one of the sides of the disposable frame-piece, the at least one breakage lug being able to break the disposable frame-piece so that it is no longer intact, during separation of the second sector from the substrate.