US 2015/0310241 A1Published application

Package-on-package based integrated circuit chip imager

AssigneeHoneywell International Inc. (d.b.a) Honeywell Scanning and Mobility

InventorsYong Liu, Taylor Smith, Ynjiun Paul Wang, Xi Tao

Life of this patent

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Abstract

An apparatus for use in decoding a bar code symbol includes a first integrated circuit chip with a wafer level camera, at least one light source, and a plurality of contact pads on a surface of the chip and a second integrated circuit chip with a processor, memory, plurality of contact pads on a surface of the chip, and plurality of contact pads on another surface of the chip. The apparatus includes a PCB having a plurality of contact pads disposed on at least one surface of the PCB and wherein the first and second integrated circuit chips are vertically stacked on the PCB and the plurality of contact pads on the first and second integrated circuit chips interface with the contact pads of the second integrated circuit chip and PCB. The apparatus is operative for processing image signals generated by the WLC for attempting to decode the bar code symbol.

Claims20

Dependent claims

An apparatus for decoding a symbol, the apparatus comprising:

a first integrated circuit chip comprising:
a wafer level camera;
and
a plurality of contact pads disposed on a first surface of the first integrated circuit chip;
a second integrated circuit chip comprising:
a plurality of contact pads disposed on a first surface of the second integrated circuit chip;
and
a plurality of contact pads disposed on a second surface of the second integrated circuit chip;
a printed circuit board comprising a plurality of contact pads disposed on a surface of the printed circuit board;
wherein the first integrated circuit chip and the second integrated circuit chip are stacked in an X-Y plane on the printed circuit board such that:
the plurality of contact pads on the first integrated circuit chip define an interface with the plurality of contact pads on the second integrated circuit chip to allow a communication of signals between the first integrated circuit chip and the second integrated circuit chip;
and
the plurality of contact pads on the second integrated circuit chip define an interface with the plurality of contact pads on the printed circuit board to allow a communication of signals between the first integrated circuit chip, second integrated circuit chip, and printed circuit board;
and
wherein the apparatus is operative for processing of image signals generated by the wafer level camera for attempting to decode a symbol.

12 more elements

An apparatus for decoding a symbol, the apparatus comprising:

a first integrated circuit chip comprising:
a wafer level camera;
and
a plurality of contact pads disposed on a first surface of the first integrated circuit chip;
a second integrated circuit chip comprising:
a plurality of contact pads disposed on a first surface of the second integrated circuit chip;
and
a plurality of contact pads disposed on a second surface of the second integrated circuit chip;
a printed circuit board comprising a plurality of contact pads disposed on a surface of the printed circuit board;
wherein the plurality of contact pads on the first integrated circuit chip define an interface with the plurality of contact pads on the second integrated circuit chip to allow a communication of signals between the first integrated circuit chip and the second integrated circuit chip;
and
wherein the plurality of contact pads on the second integrated circuit chip define an interface with the plurality of contact pads on the printed circuit board to allow a communication of signals between the first integrated circuit chip, second integrated circuit chip, and printed circuit board;
and
wherein the apparatus is operative for processing of image signals generated by the wafer level camera for attempting to decode a symbol.

11 more elements

An apparatus for decoding a symbol, the apparatus comprising:

a first integrated circuit chip comprising:
a wafer level camera;
and
a plurality of contact pads disposed on a first surface of the first integrated circuit chip;
a second integrated circuit chip comprising:
a plurality of contact pads disposed on a first surface of the second integrated circuit chip;
and
a plurality of contact pads disposed on a second surface of the second integrated circuit chip;
a printed circuit board having a first side and a second side and comprising a plurality of contact pads disposed on a surface of the printed circuit board;
wherein the plurality of contact pads on the first integrated circuit chip define an interface with the plurality of contact pads on the second integrated circuit chip to allow a communication of signals between the first integrated circuit chip and the second integrated circuit chip;
wherein the plurality of contact pads on the second integrated circuit chip define an interface with the plurality of contact pads on the printed circuit board to allow a communication of signals between the first integrated circuit chip, second integrated circuit chip, and printed circuit board;
wherein the first integrated circuit chip is mounted on the second integrated circuit chip and the second integrated circuit chip is mounted on the first side of the printed circuit board;
and
wherein the apparatus is operative for processing of image signals generated by the wafer level camera for attempting to decode a symbol.

11 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/793,933Filed 8 Jul 2015
Priority: CN 201210360191.325 Sep 2012
Published: 29 Oct 2015
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

G06K 7/10732
Photodetector array or CCD scanning: light sources
G06K 7/10881
Further details of bar or optical code scanning devices: constructional details of hand-held scanners
G06K 7/1098
Further details of bar or optical code scanning devices: the scanning arrangement having a modular construction
G06K
Graphical data reading

Family

Application14/032,989Continuation · filed 20 Sep 2013
Application14/793,933Continuation
US 2014/0166759 A1Published application
US 9,082,031 B2Related patent
US 9,430,686 B2Related patent
US 2015/0310241 A1This patent

From the US filing history. Foreign family members aren’t listed.