Method of fabricating a conductive pattern with high optical transmission, low reflectance, and low visibility

Abstract

A method of fabricating a conductive pattern includes disposing an image of the conductive pattern on a substrate. The image includes material capable of being electroless plated. The image is electroless plated with a first metal forming a plated image. The first metal includes copper. The plated image is bathed in an immersion bath that includes a metal ion source of a second metal that reacts with the first metal. The second metal includes palladium. The conductive pattern includes a first metal layer having a first metal thickness, an intermetallic first metal-second metal interface layer, and a second metal layer having a second metal thickness.

Dependencies are inferred from the claim text.