Photosensitive Resin Composition, Resist Laminate, And Articles Obtained By Curing Same (7)

A photosensitive resin composition comprising:

• an epoxy resin (A), a polyhydric phenol compound (B), a cationic photopolymerization initiator (C), an epoxy group-containing silane compound (D), and a reactive epoxy monomer (E);
• the epoxy resin (A) comprising an epoxy resin (a) produced from reaction of a phenol derivative represented by the following Formula (1) and epihalohydrin:
• and an epoxy resin (b) represented by the following Formula (2):
• wherein m is an average value, representing a real number in the range from 2 to 30, R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or a trifluoromethyl group, X each independently represents a hydrogen atom or a glycidyl group, and at least one of a plurality of X present is a glycidyl group;
• the polyhydric phenol compound (B) comprising at least one selected from the group consisting of phenol compounds represented by the following Formulas (3) to (6):
• wherein p is an average value, representing a real number in the range from 1 to 10, and R each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms,
• wherein q is an average value, representing a real number in the range from 1 to 10,
• wherein z is an average value, representing a real number in the range from 1 to 10,
• wherein y is an average value, representing a real number in the range from 1 to 10, R8 and R9 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
• and
• the reactive epoxy monomer (E) comprising a bisphenol type epoxy resin.