Testing head of electronic devices

A method for adjusting a testing head comprising a plurality of contact probes inserted into guide holes being realized in at least one upper guide and in a lower guide, and at least one containment element of said robes which is disposed between the upper and lower guides, each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut onto a respective contact pad of a device to be tested, the testing head further comprising at least one spacer element interposed between the containment element and at least one of the upper and lower guides, the method comprising the steps of:

• de-joining the spacer element, the upper or lower guide and said containment element sandwiching the spacer element;
• removing the spacer element;
• approaching the upper or lower guide and the containment element;
• and
• joining the upper or lower guide and the containment element, so as to adjust a length of the terminal portions of the contact probes which projects from the lower guide.

A testing head for a testing equipment of an electronic device comprising:

• at least one upper guide and a lower guide provided with guide holes;
• a plurality of contact probes inserted into the guide holes of the upper and lower guides;
• and
• at least one containment element of the probes disposed between the upper and lower guides,
• each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut on a respective contact pad of the electronic device to be tested,
• at least one spacer element sandwiched between the containment element and at least one of the upper and lower guides, and
• the spacer element not extending along a whole surface of the upper or the guide and being removable to adjust a length of the terminal portions of the contact probes projecting from the lower guide.