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US 2015/0308007 A1Published application
Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
AssigneeSamsung Electronics Co., Ltd.
InventorsMyung-Beom Park, Jin-Hee Lee, Baik-Soon Choi, Jung-Sik Choi
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Abstract
A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.
Claims20
A tin plating solution comprising:
- tin ions supplied from a soluble tin electrode;
- an aliphatic sulfonic acid having a carbon number in a range of 1 to 10;
- an anti-oxidant;
- a wetting agent;
- and
- a grain refiner that is an aromatic carbonyl compound.
3 more elements
A method for fabricating a semiconductor device comprising:
- forming a contact pad on a substrate;
- and
- forming a pure tin bump on the contact pad using a tin plating solution,
- wherein the tin plating solution includes an aliphatic sulfonic acid having a carbon number in a range of 1 to 10, an anti-oxidant, a wetting agent that is a polycyclic aromatic compound, and a grain refiner that is an aromatic carbonyl compound.
1 more element
Dependencies are inferred from the claim text.