Aqueous composition for etching of copper and copper alloys
AssigneeAtotech Deutschland GmbH
InventorsNorbert LÜTZOW, Gabriela SCHMIDT, Dirk TEWS
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Abstract
The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe3+ ions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.
Claims18
An aqueous composition for etching of copper and copper alloys comprising a source for Fe3+ ions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from the group consisting of N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers.
Dependencies are inferred from the claim text.