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US 2015/0307995 A1Published application
ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
AssigneeLam Research Corporation
InventorsEugenijus NORKUS, Aldona JAGMINIENE, Ina STANKEVICIENE, Aniruddha JOI, Yezdi DORDI
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Abstract
A solution for electroless deposition of palladium is provided. A reducing agent of Co2+ or Ti3+ ions is provided to the solution. Pd2+ ions are provided to the solution.
Claims20
A solution for electroless deposition of palladium, comprising:
- a reducing agent of Co2+ or Ti3+ ions;
- and
- Pd2+ ions.
A method for providing an electroless plating of a palladium containing layer, comprising:
- providing a Ti3+ or Co2+ concentrated stock solution;
- providing a Pd2+ concentrated stock solution;
- combining a flow from the Ti3+ or Co2+ concentrated stock solution with a flow from the Pd2+ concentrated stock solution and water to provide a mixed electrolyte for electrolessly depositing Pd;
- and
- exposing a substrate to the mixed electrolyte for electrolessly depositing Pd.
2 more elements
A method for providing an electroless plating of a palladium layer, comprising:
- providing a solution for electroless deposition of palladium, comprising:
- Ti3+ or Co2+ ions;
- and
- Pd2+ ions, wherein a ratio of Ti3+ or Co2+ ions to Pd2+ ion is between 100:1 to 2:1;
- and
- exposing a substrate to the solution for electroless deposition of palladium.
3 more elements
Dependencies are inferred from the claim text.