Back to results
US 2015/0307993 A1Published application
ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
AssigneeLam Research Corporation
InventorsEugenijus NORKUS, Ina STANKEVICIENE, Aldona JAGMINIENE, Aniruddha JOI, Loreta TAMASAUSKAITE-TAMASIUNAITE, Yezdi DORDI, Zita SUKACKIENE
Life of this patent
Estimating the term…
Abstract
A solution for electroless deposition of cobalt is provided. A reducing agent of Ti3+ ions is provided to the solution. Co2+ ions are provided to the solution.
Claims20
A solution for electroless deposition of cobalt, comprising:
- a reducing agent of Ti3+ ions;
- and
- Co2+ ions.
A method for providing an electroless plating of a cobalt containing layer, comprising:
- providing a Ti3+ concentrated stock solution;
- providing a Co2+ concentrated stock solution;
- combining a flow from the Ti3+ concentrated stock solution with a flow from the Co2+ concentrated stock solution and water to provide a mixed electrolyte for electrolessly depositing Co;
- and
- exposing a substrate to the mixed electrolyte for electrolessly depositing Co.
2 more elements
A method for providing an electroless plating of a cobalt layer, comprising:
- providing a solution for electroless deposition of cobalt, comprising:
- Ti3+ ions;
- and
- Co2+ ions, wherein a ratio of Ti3+ ions to Co2+ ions is between 5:1 and 1:5;
- and
- exposing a substrate to the solution for electroless deposition of cobalt.
3 more elements
Dependencies are inferred from the claim text.