Aqueous cleaner for the removal of post-etch residues
AssigneeAdvanced Technology Materials, Inc.
InventorsJeffrey A. Barnes, Steven Lippy, Peng Zhang, Rekha Rajaram
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Abstract
Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.
Claims20
An aqueous cleaning composition, comprising at least one corrosion inhibitor, water, optionally at least one chelating agent, optionally at least one etchant, optionally at least one passivating agent, and optionally at least one complexing agent, wherein said aqueous cleaning composition is suitable for cleaning post-plasma etch residue from a microelectronic device having said residue thereon.
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A method of removing material from a microelectronic device having said material thereon, said method comprising contacting the microelectronic device with an aqueous cleaning composition for sufficient time to at least partially remove said material from the microelectronic device, wherein the aqueous cleaning composition includes at least one corrosion inhibitor, water, optionally at least one chelating agent, optionally at least one etchant, optionally at least one passivating agent, and optionally at least one complexing agent.
Dependencies are inferred from the claim text.