Conductive Resilient Hollow Microsphere, Adhesive Composition, and Adhesive Articles
Assignee3M Innovation Properties Company
InventorsWeiDe Liu, Badri Veeraraghavan, Cecil V. Francis, Yiwen Chu, Jing Fang
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Abstract
A conductive resilient hollow microsphere comprises a conductive layer enclosing a resilient polymeric hollow microsphere. An adhesive composition includes an insulating adhesive component and a plurality of the conductive resilient hollow microspheres. Adhesive articles including the adhesive composition are also disclosed. Methods of making the same are also disclosed.
Claims16
1-15. (canceled)
A conductive resilient hollow microsphere comprising a conductive layer enclosing a resilient polymeric hollow microsphere.
A method comprising contacting resilient polymeric hollow microspheres with a vapor of a metal at a pressure in the range of from 1.33 pascals to 13.33 pascals, inclusive, for at least sufficient time to deposit a substantially uniform and complete layer of the metal onto the surface of the resilient organic microspheres.
Dependencies are inferred from the claim text.