Substrate structure, manufacturing method thereof, and method for manufacturing an electronic device

A method for manufacturing a substrate structure, comprising:

• providing a carrier, wherein the carrier has a top surface;
• applying a composition on the top surface of the carrier to form a coating, and subjecting the coating to a curing process to form a de-bonding layer, wherein there is a first adhesion force between the de-bonding layer and the carrier, the composition comprises:
• at least one acrylate monomer;
• and
• at least one acrylate-based oligomer, wherein the sum of acrylate group of the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3;
• and
• providing a flexible substrate to cover and contact to the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate, and the second adhesion force is greater than the first adhesion force.

A method for manufacturing an electronic device, comprising:

• providing a carrier, wherein the carrier has a top surface;
• applying a composition on the top surface of the carrier to form a coating, and subjecting the coating to a curing process to form a de-bonding layer, wherein there is a first adhesion force between the de-bonding layer and the carrier, the composition comprises:
• at least one acrylate monomer;
• and
• at least one acrylate-based oligomer, wherein the sum of acrylate group of the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3;
• providing a flexible substrate to cover and contact to the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate, and the second adhesion force is greater than the first adhesion force;
• forming at least one electronic element on the flexible substrate;
• and
• performing a de-bonding process to separate the de-bonding layer from the carrier.

A substrate structure, comprising:

• a carrier having a top surface;
• de-bonding layer disposed on the top surface, wherein the de-bonding layer is prepared from a composition, and the composition comprises:
• at least one acrylate monomer;
• and
• at least one acrylate-based oligomer, wherein the sum of acrylate group of the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3;
• and
• a flexible substrate disposed on the de-bonding layer;
• and
• a first functional layer disposed between the carrier and the de-bonding layer, or between the de-bonding layer and the flexible substrate;
• wherein, there is a fourth adhesion force between the first functional layer and the carrier, there is a fifth adhesion force between the de-bonding layer and the first functional layer, and the fifth adhesion force is greater than the fourth adhesion force when the first functional layer is disposed between the carrier and the de-bonding layer;
• or there is a first adhesion force between the de-bonding layer and the carrier, there is a fifth adhesion force between the de-bonding layer and the first functional layer, and the fifth adhesion force is greater than the first adhesion force when the first functional layer is disposed between the flexible substrate and the de-bonding layer.