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US 2015/0307689 A1Published application
Molding material and liquid ejection flow path member using the same
AssigneeCanon Kabushiki Kaisha
InventorsIsao Imamura, Yoshiyuki Shino, Shogo Kawamura
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Abstract
The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.
Claims9
A molding material comprising a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.
Dependencies are inferred from the claim text.