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US 2015/0307347 A1Published application
System on a chip using integrated mems and cmos devices
AssigneemCube Inc.
InventorXIAO "CHARLES" YANG
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Abstract
An integrated MEMS system in which CMOS and MEMS devices are provided to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured.
Claims9
A method for fabricating a semiconductor device comprising:
- receiving a semiconductor substrate;
- forming one or more CMOS devices upon the semiconductor substrate;
- forming an interface layer on top of the one or more CMOS devices;
- and
- forming one or more MEMS physical sensors upon the interface layer using a foundry compatible process.
2 more elements
Dependencies are inferred from the claim text.