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US 2015/0306737 A1Published application
Chemical mechanical polishing pad
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChang-Sheng Lin
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Abstract
The present disclosure relates to a radiance decomposable CMP pad, and an associated method to refresh the CMP pad. In some embodiments, the CMP pad has a polymer layer and some macro pores disposed therein. A monomer of the polymer layer has a photoactive compound unit.
Claims20
A chemical mechanical polishing (CMP) pad comprising a polymer layer and macro pores disposed therein, wherein a monomer of the polymer layer comprises a photoactive compound (PAC) unit.
A chemical mechanical polishing (CMP) system, comprising:
- a rotatable wafer carrier to hold a wafer face down to be processed;
- a CMP pad disposed uniformly on a rotatable polishing platen comprising a polymer layer;
- and
- a CMP dispenser to dispense a slurry between the CMP pad and the wafer;
- wherein a monomer of the polymer layer comprises a photoactive compound (PAC) unit.
2 more elements
A method of chemical mechanical polishing (CMP), the method comprising:
- placing a wafer face down on a CMP pad;
- applying a slurry between the wafer and the CMP pad;
- planarizing the wafer by applying a pressure between the wafer and the CMP pad;
- wherein a residue is formed on the CMP pad during the planarization;
- irradiating the CMP pad by a radiance source, wherein a top portion of the CMP pad is decomposed uniformly and removed together with the residue;
- and
- cleaning the CMP pad by applying an aqueous solution.
4 more elements
Dependencies are inferred from the claim text.