# US 2015/0306734 A1 · Cmp pad dresser having leveled tips and associated methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2015/0306734 A1 - Document ID: US20150306734A1 - Status: Published application - Kind: A1 - Application number: 14/644,045 - Filed: 2015-03-10 - Published: 2015-10-29 - Earliest claimed: 2011-05-23 - Inventors: Chien-Min Sung - Web page: https://patentgrep.com/patent/US20150306734A1 ## CPC - B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools - B24B 53/12: Dressing tools; Holders therefor - B24D 3/06: metallic {or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements} - B24D 7/00: Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - Y10T 428/24372: Particulate matter - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - B24D: TOOLS FOR GRINDING, BUFFING OR SHARPENING (abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls B24B31/14; honing tools B24B33/08; lapping tools B24B37/11) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less. ## Claims ### Claim 1 A CMP pad dresser, comprising: a rigid support substrate having a plurality of superabrasive particles bonded thereto with a matrix material and protruding from the matrix material with a difference in protrusion distance between the highest 100 protruding superabrasive particle tips of less than or equal to about 50 microns. ### Claim 2 (depends on 1) The dresser of claim 1, wherein the difference in protrusion distance between the highest protruding super abrasive particle tip and the 100th highest protruding superabrasive particle tip is less than or equal to about 40 microns. ### Claim 3 (depends on 1) The dresser of claim 1, wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the 10th highest protruding superabrasive particle tip is less than or equal to about 20 microns. ### Claim 4 (depends on 3) The dresser of claim 3, wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the 10th highest protruding superabrasive particle tip is less than or equal to about 10 microns. ### Claim 5 (depends on 1) The dresser of claim 1, wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the second highest protruding superabrasive particle tip is less than or equal to about 15 microns. ### Claim 6 (depends on 5) The dresser of claim 5, wherein the difference in protrusion distance between the highest protruding superabrasive particle tip and the second highest protruding superabrasive particle tip is less than or equal to about 10 microns. ### Claim 7 (depends on 1) The dresser of claim 1, wherein the highest protruding superabrasive particle tip protrudes from the matrix material to a height greater than or equal to about 50 microns. ### Claim 8 (depends on 1) The CMP pad dresser of claim 1, wherein the superabrasive particles have a mesh size of from 325/400 to 10/20. ### Claim 9 (depends on 1) The dresser claim 1, wherein the superabrasive particles are oriented in an attitude having a sharp portion oriented towards a pad to be dressed. ### Claim 10 (depends on 9) The dresser of claim 9, wherein the plurality of superabrasive particles are substantially all oriented in an attitude having either an apex or an edge portion oriented toward a pad to be dressed. ### Claim 11 (depends on 9) The dresser of claim 9, wherein the sharp portion has degree of sharpness correlated with a geometric angle of from 30 degrees or less to 90 degrees or less. ### Claim 12 (depends on 11) The dresser of claim 11, wherein the geometric angle is 45 degrees or less. ### Claim 13 (depends on 1) The dresser of claim 1, wherein the superabrasive particles are diamond particles. ### Claim 14 (depends on 1) The dresser of claim 1, wherein the superabrasive particles are polycrystalline diamond. ### Claim 15 (depends on 1) The dresser of claim 1, wherein the matrix material is a member selected from the group consisting of: metal brazes, metal braze alloys, organic matrix materials, sintered materials, electroplated materials, and a combination thereof. ### Claim 16 (depends on 15) The dresser of claim 15, wherein the bonding material is a metal braze alloy. ### Claim 17 A CMP pad dresser, comprising: a rigid support substrate; a matrix material disposed on the support substrate; and a plurality of superabrasive particles held in and protruding from the matrix material, wherein the highest 1% of superabrasive particle tips have a protrusion distance variance of about 80 microns or less. ### Claim 18 (depends on 17) The CMP pad dresser of claim 17, wherein the variance is 70 microns or less. ### Claim 19 (depends on 18) The CMP pad dresser of claim 18, wherein the variance is 50 microns or less. ### Claim 20 (depends on 17) The CMP pad dresser of claim 17, wherein the superabrasive particles are oriented in an attitude having a sharp portion oriented towards a pad to be dressed, and said sharp portion has degree of sharpness correlated with a geometric angle of from 30 degrees or less to 90 degrees or less.