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US 2015/0306731 A1Published application
Chemical mechanical polishing pad
OwnerBainian Qian, Marty W. DeGrootinventors
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Abstract
A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, including: an isocyanate terminated urethane prepolymer; and, a curative system, containing a high molecular weight polyol curative; and, a difunctional curative.
Claims10
A chemical mechanical polishing pad, comprising:
- a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, comprising:
- an isocyanate terminated urethane prepolymer having 8.5 to 9.5 wt % unreacted NCO groups;
- and,
- a curative system, comprising:
- 10 to 60 wt % of a high molecular weight polyol curative, wherein the high molecular weight polyol curative has a number average molecular weight, MN, of 2,500 to 100,000;
- and wherein the high molecular weight polyol curative has an average of 3 to 10 hydroxyl groups per molecule;
- and,
- 40 to 90 wt % of a difunctional curative.
5 more elements
Dependencies are inferred from the claim text.