Alloys
AssigneesUmicore AG & Co. KG, Leibniz-Institut für Festkörper-und Werkstofffor- schung Dresden e.V.
InventorsGunther WIEHL, Frank SILZE, Bernd KEMPF
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Abstract
Novel alloys which can be employed in joining technology and have improved wetting properties are described.
Claims21
A solder alloy consisting of from 41% by weight to 75% by weight of copper, from 20% by weight to 44% by weight of silver, from 5% by weight to 15% by weight of gallium and from 0 to 15% by weight of further alloy constituents selected from the group consisting of indium, tin, germanium, titanium, manganese, silicon, nickel and combinations thereof, wherein the constituents add up to 100% by weight and can contain unavoidable impurities and the content of zinc must not exceed 0.01% by weight.
(canceled)
Dependencies are inferred from the claim text.