Method of Inhibiting Copper Deposition on Hair

1) A method of inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair comprising:

• a. applying to the hair a shampoo composition comprising:
• i. from about 0.025% to about 0.25% of a compound selected from the group consisting of ethylenediamine-N,N′-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N′-disuccinic acid (EDDS), salts of ethylenediamine-N,N′-disuccinic acid (EDDS), histidine, and mixtures thereof, by weight of the shampoo composition;
• ii. from about 2% to about 50% of one or more detersive surfactants, by weight of the shampoo composition;
• and
• iii. from about 20% to about 95% of a first aqueous carrier, by weight of the shampoo composition;
• b. rinsing the shampoo composition from the hair;
• c. applying to the hair a conditioner composition comprising:
• i. from about 0.025% to about 0.25% histidine, by weight of the conditioner composition;
• ii. a conditioner gel matrix comprising:
• 1. from about 0.1% to about 20% of one or more high melting point fatty compounds, by weight of the gel matrix;
• 2. from about 0.1% to about 10% of a cationic surfactant system, by weight of the gel matrix;
• and
• 3. at least 20% of a second aqueous carrier, by weight of the gel matrix;
• d. rinsing the conditioner composition from the hair;
• and
• e. applying to the hair a leave-on treatment comprising:
• i. from about 0.025% to about 0.25% of a compound selected from the group consisting of ethylenediamine-N,N′-disuccinic acid (EDDS), derivatives of ethylenediamine-N,N′-disuccinic acid (EDDS), salts of ethylenediamine-N,N′-disuccinic acid (EDDS), and mixtures thereof, by weight of the leave-on treatment;
• ii. one or more rheology modifiers;
• and
• iii. at least 20% of a third aqueous carrier, by weight of the leave-on treatment.