Back to results
US 2015/0306004 A1Published application
Method of Inhibiting Copper Deposition on Hair
AssigneeThe Procter & Gamble Company
InventorsJennifer Mary MARSH, Casey Patrick KELLY
Life of this patent
Estimating the term…
Abstract
A method of inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair including applying to the hair a shampoo composition having histidine, rinsing the shampoo composition from the hair, applying to the hair a conditioner composition comprising histidine, and rinsing the conditioner composition from the hair.
Claims15
1) A method of inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair comprising:
- a. applying to the hair a shampoo composition comprising:
- i. from about 0.025% to about 0.25% histidine, by weight of the shampoo composition;
- ii. from about 2% to about 50% of one or more detersive surfactants, by weight of the shampoo composition;
- and
- iii. from about 20% to about 95% of a first aqueous carrier, by weight of the shampoo composition;
- b. rinsing the shampoo composition from the hair;
- c. applying to the hair a conditioner composition comprising:
- i. from about 0.025% to about 0.25% histidine, by weight of the conditioner composition;
- ii. a conditioner gel matrix comprising:
- 1. from about 0.1% to about 20% of one or more high melting point fatty compounds, by weight of the conditioner gel matrix;
- 2. from about 0.1% to about 10% of a cationic surfactant system, by weight of the conditioner gel matrix;
- and
- 3. at least 20% of a second aqueous carrier, by weight of the conditioner gel matrix;
- and
- d. rinsing the conditioner composition from the hair.
12 more elements
Dependencies are inferred from the claim text.