Thermal interface compositions and methods for making and using same
Assignee3M Innovative Properties Company
InventorsAndrew J. Ouderkirk, Ravi K. Sura, Hun Jeong
Life of this patent
Estimating the term…
Abstract
A thermal interface material includes a conformable component and a thermally conductive filler dispersed in the conformable component. The material is provided in at least two segments laterally spaced from one another to define one or more gaps, each of the segments having a length, a width, and a height. The average aspect ratio of length to height and/or width to height of the at least two segments is between 1:10 and 10:1.
Claims17
A thermal interface material comprising:
- a conformable component;
- and
- a thermally conductive filler dispersed in the conformable component;
- wherein the material is provided in at least two segments laterally spaced from one another to define one or more gaps, each of the segments having a length, a width, and a height;
- and
- wherein the average aspect ratio of length to height and/or width to height of the at least two segments is between 1:10 and 10:1.
The thermal interface material of 8, wherein a height of the base layer in the first direction is between 1 μm and 1 mm.
A method for making a thermal interface material, the method comprising:
- providing a thermal interface material, the thermal interface material comprising a conformable component and thermally conductive particles;
- casting the thermal interface material into a mold, wherein the mold is configured to provide the thermal interface material with a pattern whereby the thermal interface material is provided in at least two segments laterally spaced from one another to define one or more gaps, each of the segments having a length, a width, and a height, and wherein the average aspect ratio of length to height and/or width to height of the at least two segments is between 1:10 and 10:1;
- removing the thermal interface material from the mold.
Dependencies are inferred from the claim text.