Composition of a solder, and method of manufacturing a solder connection
AssigneeKoninklijke Philips N.V.
InventorsNICOLAAS JOHANNES ANTONIUS VAN VEEN, HOSSAIN MOHAMMAD BIGLARI
Life of this patent
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Abstract
The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
Claims10
A substrate with a bonding area on which a layer of a solder composition is present, and wherein particles of a thermodynamically metastable alloy are dispersed in the solder composition, the alloy comprising an element that, upon application of the composition to a metal oxide containing surface, forms an intermetallic compound with the metal of said surface.
An assembly of a first and a second substrate provided with surfaces which, at a first area, are mutually interconnected by an electrically conducting connection of a solder composition, and wherein an adhesion layer comprising an intermetallic compound is present at an interface of at least one of the first area and the solder connection, said compound comprising an element present in the first area and an alloying element originating from the solder composition.
Dependencies are inferred from the claim text.