Copper clad laminate and method for manufacturing the same

Abstract

A copper clad laminate is introduced. Cyclic olefin copolymer fabric functions as a base fabric for manufacturing the copper clad laminate to reduce dielectric constant (Dk) and dissipation factor (Df) of the copper clad laminate. The flame-retarded curing agent included in the resin for use in manufacturing the copper clad laminate is halogen-free and does not cause environmental pollution. The cyclic phosphate structure of the flame-retarded curing agent enhances thermal stability and chemical stability of the copper clad laminate thus manufactured. During the manufacturing process of the copper clad laminate, an annealing process is performed while thermal curing and lamination is taking place to prevent bending otherwise resulting from a difference in thermal expansion coefficient between cyclic olefin copolymer fabric and glass fiber fabric.

Dependencies are inferred from the claim text.