Method and structure for determining thermal cycle reliability

A test structure used to determine reliability performance, comprising:

• a patterned metallization structure having a plurality of interfaces, which provide stress risers;
• a dielectric material surrounding the metallization structure, where a mismatch in coefficients of thermal expansion (CTE) between the metallization structure and the surrounding dielectric material exist such that a thermal strain value is provided to cause failures under given stress conditions as a result of CTE mismatch to provide a yield indicative of reliability for a manufacturing design;
• the test structure including at least one of:
• a via chain formed through layers of the test structure such that a plurality of widths of vias are used to adjust strain in different layers, and a dummy structure configured to provide a via density in an area of the test structure to adjust strain in adjacent structures of the test structure.