Device and method for wafer taping

A method of taping a wafer, comprising:

• providing a wafer taping device, comprising:
• a tape delivering along a first direction;
• a wafer mount unit having an upper surface and a notch on the upper surface, wherein the notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction;
• and
• a laminating roller disposed over the wafer mount unit and the tape;
• positioning a wafer to the upper surface of the wafer mount unit, wherein the wafer has a cut mark, and the cut mark is aligned with the notch;
• reciprocating the laminating roller for pressing the tape to the wafer;
• and
• cutting the tape along a perimeter of the wafer.

A wafer taping device, comprising:

• a tape feeder delivering a tape along a first direction;
• a winding roller winding a release of the tape drawn out from the tape feeder;
• a wafer mount unit disposed between the tape feeder and the winding roller, wherein the wafer mount unit has an upper surface for supporting a wafer and having a plurality notches for allowing a cut mark of the wafer to align with one of the notches, wherein at least one of the plurality of notches is staggered with a second direction in the upper surface, wherein the second direction is substantially perpendicular to the first direction;
• and
• a laminating roller disposed above the wafer mount unit and being a cylinder that has a long axis elongated in the second direction, wherein the laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.