# US 2015/0216092 A1 · Forced convection pre-heater for wave solder machine and related method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2015/0216092 A1 - Document ID: US20150216092A1 - Status: Published application - Kind: A1 - Application number: 14/165,761 - Filed: 2014-01-28 - Published: 2015-07-30 - Earliest claimed: 2014-01-28 - Assignees: Illinois Tool Works Inc. - Applicants: Illinois Tool Works Inc. - Inventors: Jonathan M. Dautenhahn - Web page: https://patentgrep.com/patent/US20150216092A1 ## CPC - H05K 13/0465: {by soldering (H05K13/0469 takes precedence)} - B23K 1/0016: {Soldering of electronic components} - B23K 1/012: Soldering with the use of hot gas - B23K 1/085: {Wave soldering} - B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating - B23K 3/0653: {with wave generating means, e.g. nozzles, jets, fountains} - B23K 3/082: {Flux dispensers; Apparatus for applying flux} - B23K 37/04: for holding or positioning work - B23K 2101/42: Printed circuits - H05K 3/3468: Application of molten solder, e.g. dip soldering - H05K 2203/111: Preheating, e.g. before soldering - H05K 2203/1527: Obliquely held PCB - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A wave solder machine is configured to perform a wave solder operation on an electronic substrate. The wave solder machine includes a pre-heating station configured to heat the electronic substrate, a wave soldering station configured to attach electronic components to the electronic substrate with solder, and a conveyor configured to transport substrates through a tunnel passing through the fluxing station, the pre-heating station and the wave soldering station. The pre-heating station includes at least one pre-heater including an outer chamber housing, a compression box assembly disposed in the outer chamber housing, a diffuser plate disposed above the compression box assembly, and at least one heating element disposed in the outer chamber housing. The pre-heater is configured to draw heated gas into the compression box assembly from the tunnel, heat the gas, and exhaust the heated gas out to the tunnel through the diffuser plate. ## Claims ### Claim 1 A wave solder machine configured to perform a wave solder operation on an electronic substrate, the wave solder machine comprising: a pre-heating station configured to heat the electronic substrate; a wave soldering station configured to attach electronic components to the electronic substrate with solder; and a conveyor configured to transport substrates through a tunnel passing through the fluxing station, the pre-heating station and the wave soldering station, wherein the pre-heating station includes at least one pre-heater including an outer chamber housing, a compression box assembly disposed in the outer chamber housing, a diffuser plate disposed above the compression box assembly, and at least one heating element disposed in the outer chamber housing, the pre-heater being configured to draw heated gas into the compression box assembly from the tunnel, heat the gas, and exhaust the heated gas out to the tunnel through the diffuser plate. ### Claim 2 (depends on 1) The wave solder machine of claim 1, wherein the compression box assembly includes a compression box housing having at least one intake port located adjacent the at least one heating element, and an intake duct disposed in the compression box housing, the intake duct having at least one inlet opening in fluid communication with the at least one intake port of the compression box housing and an outlet opening. ### Claim 3 (depends on 2) The wave solder machine of claim 2, wherein the compression box assembly further includes a pressure distribution device positioned between the intake duct and the compression box housing at a location of the outlet opening. ### Claim 4 (depends on 3) The wave solder machine of claim 3, wherein the pressure distribution device includes at least one vane to enable fluid communication from outlet opening of the intake duct to the diffuser plate. ### Claim 5 (depends on 3) The wave solder machine of claim 3, wherein the compression box assembly further includes a blower device positioned within the pressure distribution device, the blower device being configured to direct heated gas from the intake duct to the diffuser plate. ### Claim 6 (depends on 2) The wave solder machine of claim 2, wherein the compression box assembly further includes a pressure equalizing plate positioned between the intake duct and the diffuser plate. ### Claim 7 (depends on 6) The wave solder machine of claim 6, wherein the pressure equalizing plate extends from one end of the intake duct to an opposite end of the intake duct. ### Claim 8 (depends on 2) The wave solder machine of claim 2, wherein the diffuser plate includes a plurality of openings formed therein. ### Claim 9 (depends on 8) The wave solder machine of claim 8, wherein each opening has a protruding nozzle formed around the opening. ### Claim 10 (depends on 2) The wave solder machine of claim 2, wherein the compression box housing includes two intake ports, and wherein the intake duct includes two inlet openings aligned to and in fluid communication with the two intake ports of the compression box housing. ### Claim 11 (depends on 10) The wave solder machine of claim 10, wherein the compression box housing has two ends, each end having an intake port, and wherein the intake duct includes two open ends, each side having an inlet opening. ### Claim 12 (depends on 1) The wave solder machine of claim 1, further comprising at least two heating elements disposed at opposite ends of the compression box assembly within the outer chamber housing. ### Claim 13 A method of distributing heated gas within a wave soldering machine of the type comprising a pre-heating station configured to heat the electronic substrate, a wave soldering station configured to attach electronic components to the electronic substrate with solder, and a conveyor configured to transport substrates through a tunnel passing through the fluxing station, the pre-heating station and the wave soldering station, the pre-heating station including at least one pre-heater including an outer chamber housing, a compression box assembly disposed in the outer chamber housing, a diffuser plate disposed above the compression box assembly, and at least one heating element disposed in the outer chamber housing, the method comprising: drawing gas into the outer chamber housing between the outer chamber housing and the compression box assembly from the tunnel; heating the gas; and exhausting the heated gas out to the tunnel through the diffuser plate. ### Claim 14 (depends on 13) The method of claim 13, further comprising positioning a pressure distribution device within the compression box assembly. ### Claim 15 (depends on 14) The method of claim 14, further comprising positioning a blower device in the pressure distribution device, the blower device being configured to direct heated gas from the compression box assembly to the diffuser plate. ### Claim 16 (depends on 13) The method of claim 13, further comprising positioning a pressure equalizing plate within the compression box assembly.