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US 2015/0206734 A1Published application
Method and manufacturing system
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWEI-PIN HUANG, WEN-CHI CHIEN, BING-YUAN CHENG, FENG-NING LEE, WEI-CHENG WANG
Life of this patent
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Abstract
A method is provided. The method includes: assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment; and assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.
Claims20
A method, comprising:
- asking a first overhead hoist transport to prepare to transfer a first lot out of a tool after a current lot treatment to a current lot within the tool is complete;
- and
- asking a second overhead hoist transport to prepare to transfer a second lot to the tool after the current lot treatment within the tool is complete and the current lot is ready to move out of the tool.
A method, comprising:
- assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment;
- and
- assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.
A manufacturing system, comprising:
- a buffer, assigned to a first wafer lot according to a first trigger event associated with an equipment;
- a first transporter, assigned to a second wafer lot according to a second trigger event associated with the equipment;
- and
- a controller, using real-time data associated with the equipment to assign the buffer to the first wafer lot and to assign the first transporter to the second wafer lot.
1 more element
Dependencies are inferred from the claim text.