Composition and method for polishing memory hard disks
AssigneeCabot Microelectronics Corporation
InventorsSelvaraj PALANISAMY CHINNATHAMBI, Michael WHITE
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Abstract
The invention provides a chemical-mechanical polishing composition containing aluminate-modified silica particles, a polyacrylamide, a heterocyclic film-forming agent, and water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
Claims20
A chemical-mechanical polishing composition comprising:
- (a) about 0.001 wt. % to about 10 wt. % of aluminate-modified silica particles,
- (b) about 1 ppm to about 1000 ppm of a polyacrylamide,
- (c) optionally, a heterocyclic film-forming agent, and
- (d) water,
- wherein the polishing composition has a pH of about 1 to about 7.
A method of chemically-mechanically polishing a substrate, which method comprises:
- (i) providing a substrate,
- (ii) providing a polishing pad,
- (iii) providing a polishing composition comprising:
- (a) about 0.001 wt. % to about 10 wt. % of aluminate-modified silica particles,
- (b) about 1 ppm to about 1000 ppm of a polyacrylamide,
- (c) optionally, a heterocyclic film-forming agent, and
- (d) water,
- wherein the polishing composition has a pH of about 1 to about 7,
- (iv) contacting a surface of the substrate with the polishing pad and the polishing composition, and
- (v) abrading at least a portion of the surface of the substrate to remove at least a portion of the surface of the substrate to polish the surface of the substrate.
Dependencies are inferred from the claim text.