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US 2015/0189802 A1Published application
Conducting package structure and manufacturing method thereof
AssigneeTai-Saw Technology Co., Ltd.
InventorsYu-Tung Huang, Ming-Hung Chang
Life of this patent
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Abstract
A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.
Claims20
A method for manufacturing a conducting package, comprising:
- providing a substrate;
- forming a conducting structure on the substrate, wherein the conducting structure has a surface;
- patterning the surface to form a patterned surface;
- dispensing a glue material on the patterned surface, wherein a wetting angle between the glue material and the patterned surface is determined by the patterned surface;
- and
- disposing an electronic device on the glue material.
3 more elements
A conducting package structure, comprising:
- a substrate, a conducting structure and a glue material, wherein:
- the conducting structure is formed on the substrate, and has a patterned surface;
- and
- the glue material is disposed on the patterned surface, wherein a wetting angle between the glue material and the patterned surface is determined by the patterned surface.
1 more element
A conducting package structure, comprising:
- a substrate;
- and
- a conducting structure having a first surface disposed on the substrate and a second surface formed with a plurality of guide rods, wherein any two adjacent guide rods have therebetween a distance larger than two times of a width of any of the two adjacent guide rods.
A conducting package structure, comprising:
- a substrate;
- and
- a conducting material formed with a first patterned structure, wherein the first patterned structure has a first surface disposed on the substrate and a second surface opposite to the first surface.
Dependencies are inferred from the claim text.