Magnetic field shielding for packaging build-up architectures
AssigneeIntel Corporation
InventorsSasha Oster, Sarah Haney, Weng Hong Teh, Feras Eid
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AssigneeIntel Corporation
InventorsSasha Oster, Sarah Haney, Weng Hong Teh, Feras Eid
Estimating the term…
Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated with the build-up to a target device configured to operate in the field. In embodiments, a first device is physically coupled to the build-up. In embodiments, a magnetic field shielding material is disposed in contact with the build-up and in proximity to the first device to restrict a magnetic field either to a region occupied by the first device or to a region exclusive of the first device. A field shielding material may be disposed within build-up near a permanent magnet also within the build-up to reduce exposure of another device, such as an IC, to the magnetic field without reducing MEMS device exposure.
1-23. (canceled)
An apparatus comprising:
A method of forming a packaging build-up, the method comprising:
An apparatus comprising:
A mobile device, comprising:
Dependencies are inferred from the claim text.