Semiconductor package and method therefor
AssigneeSemiconductor Components Industries, LLC
InventorsAtapol PRAJUCKAMOL, Chee Hiong CHEW, Yushuang YAO
Life of this patent
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Abstract
In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.
Claims20
A semiconductor package comprising:
- a housing having a first side;
- a second side opposite the first side;
- a third side extending at an angle from the first side toward the second side;
- an interior portion configured for housing a semiconductor device formed on a semiconductor substrate;
- a first projection portion of the first side extending from the first side a first distance past the third side;
- a second projection portion of the second side extending from the second side a second distance past the third side;
- and
- a first attachment clip having a first end attached to the first projection portion and a second end attached to the second projection portion and having a main portion that extends between the first and second ends.
A method of forming a semiconductor package comprising:
- forming a first side of the package substantially parallel to a second side of the package;
- forming a first attachment clip extending between the first and second sides and positioned near a first end of the first and second sides wherein the first attachment clip is attached to the first and second sides;
- forming a second attachment clip extending between the first and second sides and positioned near an opposite end of the first and second sides wherein the second attachment clip is attached to the first and second sides;
- forming a first opening through the first attachment clip and forming a second opening through the second attachment clip;
- and
- forming a first loop in the first attachment clip and forming a second loop in the second attachment clip wherein the first loop is a portion of the first attachment clip that extends away from a plane of the first attachment clip and the second loop is a portion of the second attachment clip that extends away from a plane of the second attachment clip.
A method of forming a semiconductor package comprising:
- forming a package having a first side and a second side that is substantially opposite to the first side;
- forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides;
- forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.
Dependencies are inferred from the claim text.