Printed circuit board copper plane repair
AssigneeInternational Business Machines Corporation
InventorsMahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez
Life of this patent
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Abstract
A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
Claims13
A device, comprising:
- a base having a mounting surface with a length;
- and
- a stack having a first diameter smaller than the length and fastened to the mounting surface and having
- a plurality of stack conductive layers, and
- a plurality of insulating layers separating each of the plurality of stack conductive layers in a manner configured to align the plurality of stack conductive layers with corresponding printed circuit board conductive layers in a printed circuit board when the stack is inserted into an aperture within the printed circuit board.
An assembly, comprising:
- a printed circuit board having
- a back side,
- a number of insulating layers,
- a second number of printed circuit board conductive layers,
- at least one conductive via that penetrates into the printed circuit board, and
- an aperture substantially concentric with the conductive via that partially penetrates the printed circuit board from the back side;
- and
- a device having
- a base with a mounting surface with a length;
- and
- a stack with
- a diameter smaller than the length and fastened to the mounting surface and with
- a plurality of stack conductive layers, and
- a plurality of insulating layers separating each of the plurality of stack conductive layers in a manner configured to align the plurality of stack conductive layers with corresponding printed circuit board conductive layers in the printed circuit board when the stack is inserted into an aperture in the printed circuit board,
- the device being located within the aperture in the printed circuit board such that at least one of the plurality of stack conductive layers makes electrical contact with at least one printed circuit board conductive layer in a printed circuit board.
A method of making an assembly, the method comprising:
- creating a device with
- a base having a mounting surface with a length, and
- a stack having a diameter smaller than the length and fastened to the mounting surface and having;
- a plurality of stack conductive layers, and
- a plurality of stack insulating layers separating each of the plurality of stack conductive layers in a manner configured to align the plurality of stack conductive layers with corresponding printed circuit board conductive layers in a printed circuit board when the stack is inserted into an aperture within a printed circuit board;
- creating the aperture in the printed circuit board having a plurality of printed circuit board insulating layers and a plurality of printed circuit board conductive layers, the aperture penetrating at least one of the plurality of printed circuit board conductive layers;
- aligning the stack with the aperture in the printed circuit board;
- inserting the stack into the aperture in a manner to align and to electrically interconnect each of the plurality of stack conductive layers with one of the plurality of printed circuit board conductive layers;
- and
- fastening the base to the printed circuit board.
Dependencies are inferred from the claim text.