Wiring board, method for fabricating the same, and electronic apparatus
AssigneeFujitsu Limited
InventorsTomoyuki AKAHOSHI, Daisuke Mizutani, Motoaki Tani
Life of this patent
Estimating the term…
Abstract
A wiring board includes a conductor formed on an inner wall of a through hole made in a core board, resin formed inside the conductor in the through hole, and, for example, a land formed over the conductor and the resin. Vias are formed over the land. The vias are connected to a plurality of connection regions of the land extending over the conductor and the resin in the through hole. The land is held by the vias connected to the plurality of connection regions. This controls the thermal expansion of the resin to a land side and therefore prevents a fracture of the land.
Claims13
A wiring board comprising:
- a first insulating portion;
- a first through hole made in the first insulating portion;
- a first conductor portion formed on an inner wall of the first through hole;
- a first resin portion formed inside the first conductor portion in the first through hole;
- a second conductor portion formed over the first conductor portion and the first resin portion;
- a second insulating portion formed over the second conductor portion;
- and
- a third conductor portion formed in the second insulating portion and connected to a plurality of first regions of the second conductor portion extending over the first conductor portion and the first resin portion.
A wiring board fabrication method comprising:
- making a first through hole in a first insulating portion;
- forming a first conductor portion on an inner wall of the first through hole;
- forming a first resin portion inside the first conductor portion in the first through hole;
- forming a second conductor portion over the first conductor portion and the first resin portion;
- forming a second insulating portion over the second conductor portion;
- and
- forming in the second insulating portion a third conductor portion connected to a plurality of first regions of the second conductor portion extending over the first conductor portion and the first resin portion.
An electronic apparatus comprising:
- a wiring board;
- and
- an electronic part mounted on the wiring board,
- wherein the wiring board includes:
- a first insulating portion;
- a first through hole made in the first insulating portion;
- a first conductor portion formed on an inner wall of the first through hole;
- a first resin portion formed inside the first conductor portion in the first through hole;
- a second conductor portion formed over the first conductor portion and the first resin portion;
- a second insulating portion formed over the second conductor portion;
- and
- a third conductor portion formed in the second insulating portion and connected to a plurality of first regions of the second conductor portion extending over the first conductor portion and the first resin portion.
Dependencies are inferred from the claim text.