Back to results
US 2015/0189747 A1Published application
Thermosetting resin composition and use thereof
AssigneeShengyi Technology Co., Ltd.
InventorsXianping ZENG, Nana REN
Life of this patent
Estimating the term…
Abstract
The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.
Claims20
A thermosetting resin composition comprising of:
- (A) cyanate ester compound and/or cyanate ester prepolymer;
- (B) polyphosphonate ester and/or phosphonate-carbonate copolymer.
Dependencies are inferred from the claim text.