Moisture reduction in an electric assembly
AssigneeTelefonaktiebolaget L M Ericsson (publ)
InventorsGöran Snygg, Daniel Sjöberg
Life of this patent
Estimating the term…
Abstract
The present invention relates to an electric assembly (1) comprising at least one semi-conductor component (2, 3, 4, 5; 6, 7, 8, 9; 10, 11, 12). The electric assembly (1) is arranged to be switched between a first mode and a second mode, where the electric assembly is arranged to be run in a stand-by condition during the first mode and in an operational condition during the second mode. The electric assembly (1) is arranged to be switched between a stand-by condition and a heating condition during the first mode, at least one semiconductor component (2, 3, 4, 5; 6, 7, 8, 9; 10, 11, 12) being run during the heating condition such that an amount of heat is generated. The present invention also relates to a corresponding method.
Claims16
An electric assembly comprising at least one semiconductor component, the electric assembly being arranged to be switched between a first mode and a second mode, where the electric assembly is arranged to be run in a stand-by condition during the first mode and where the electric assembly is arranged to be run in an operational condition during the second mode, wherein the electric assembly is arranged to be switched between a stand-by condition and a heating condition during the first mode, and at least one semiconductor component is run during the heating condition such that an amount of heat is generated.
A method for heating an electric assembly in order to reduce moisture in the electric assembly, the method comprising:
- switching between a first mode and a second mode, the second mode being associated with an operational condition;
- during the first mode, switching between a stand-by condition and a heating condition;
- and
- during the heating condition, supplying power to at least one semiconductor component such that an amount of heat is generated.
Dependencies are inferred from the claim text.