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US 2015/0189446 A1Published application
Silicon Condenser Microphone
AssigneeAac Acoustic Technologies (Shenzhen) Co., Ltd.
InventorsKai Wang, Zhijiang Wu
Life of this patent
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Abstract
A silicon condenser microphone is disclosed. The silicon condenser microphone includes a substrate having a top surface, a lower surface opposed to the top surface, and a recess concave from the top surface toward the lower surface. The recess includes a bottom for carrying a chip thereon. The microphone further includes a transducer spanning the recess. By virtue of this configuration, the size of the microphone is reduced, and acoustic performance of the microphone is accordingly improved.
Claims14
A silicon condenser microphone, comprising:
- a substrate, comprising a top surface, a lower surface opposed to the top surface, and a recess concave from the top surface toward the lower surface, the recess having a bottom;
- a cover mounted with the substrate for forming a cavity;
- a chip received in the recess and mounted on the bottom;
- a transducer unit accommodated in the cavity and spanning the recess;
- wherein
- the transducer unit includes a volume communicating with the recess.
3 more elements
A silicon condenser microphone, comprising:
- a substrate defining a top surface, a lower surface opposed to the top surface, and a recess having an opening at the top surface;
- a cover engaging with the substrate for forming a cavity;
- a plurality of electrodes arranged on the lower surface;
- a transducer mounted on the top surface with a volume thereof communicating with the recess;
- a chip received in the recess and mounted on a bottom of the recess.
2 more elements
Dependencies are inferred from the claim text.