Substrate carrier device for double-sided electroplating of solar cell

A substrate carrier device for electroplating surfaces of a wafer, comprising:

• a frame structured to include first and second surfaces on opposing sides of the frame, at least one opening area in the frame penetrating through the first and second surfaces to form a wafer receiving area within the frame, and first and second protrusion supporting parts on edges of the wafer receiving area within the frame, the wafer receiving area structured to support an edge of a wafer to be received by the first and second protrusion supporting parts and each second protrusion supporting part including a hole;
• a supporting part engaged to the frame for engaging to a transfer device;
• two clip mounting rods located at opposing sides of the wafer receiving area, respectively, and mounted to allow rotation of the two clip mounting rods to control a clip opening to form a contact point with the wafer and to control a clip closing to release the contact point with the wafer;
• a plurality of first clips on the clip mounting rods to be above or near the first surface and spaced apart by a predetermined distance from one another on each clip mounting rod, the first clips being rotated by a rotation of a respective clip mounting rod between a clip opening position and a clip closing position;
• and
• a plurality of second clips installed around the wafer receiving area on the second surface of the frame, each second clip positioned to pass through a hole of a respective second protrusion supporting part and having ends disposed higher than a surface of the second protrusion supporting part.

A substrate carrier device for electroplating surfaces of one or more wafers by holding and positioning the one or more wafers in a bath of a plating solution, comprising:

• a frame structured to include one or more opening areas in the frame so that each opening area forms a wafer receiving area within the frame to receive one wafer for electroplating surfaces of each received wafer in the bath of the plating solution,
• wherein each wafer receiving area includes:
• two clip mounting rods located at opposing sides of each wafer receiving area, respectively and mounted at respective fixed positions to allow rotation of the two clip mounting rods;
• first clips engaged to the two clip mounting rods spaced apart by a predetermined distance from one another on each clip mounting rod, wherein positions of the first clips can be changed by a rotation of a respective clip mounting rod between a clip opening position and a clip closing position;
• and
• second clips installed on edges of each wafer receiving area, wherein first and second clips collectively operate to hold a received wafer in position within each wafer receiving area to expose the two opposite surfaces of each received wafer to the bath of the plating solution.