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AssigneeBASF SE
InventorsYuzhuo Li, Bastian Marten Noller, Christophe Gillot, Diana Franz
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A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.
A process for manufacturing semiconductor devices, the process comprising:
A process for chemical-mechanically polishing a substrate or a layer, the process comprising:
A process for manufacturing semiconductor devices, the process comprising:
A process for chemical-mechanically polishing a substrate or a layer, the process comprising:
Dependencies are inferred from the claim text.