Method and device for joining conductors to substrates
AssigneeMaschinenfabrik Reinhausen GmbH
InventorElshad Shirinov
Life of this patent
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Abstract
The present invention relates to a method and a device (1) for joining conductors (10) to substrates (20). The device (1) comprises at least one positioning unit (40) which positions a conductor (10) in a section (33) to be connected on or near the substrate (20). A plasma (51) is generated in at least one plasma source (50). At least one feed line (55) serves for feeding a connecting material (30) into the plasma (51) of the plasma source (50). Furthermore, a plurality of devices (1) according to the present invention can be combined in a system which is designed for the parallel processing of one or a plurality of substrates (20).
Claims19
A device for joining a conductor to a substrate, comprising:
- a positioning unit for positioning the conductor with a section to be joined relative to the substrate;
- at least one first plasma source for generating a plasma;
- at least one first feed line for feeding a connecting material into the plasma of the at least one first plasma source;
- and,
- at least one nozzle of the at least one first plasma source through which a plasma jet with an activated connecting material contained therein is directed onto the section to be joined, so that a disposal joins the conductor with the substrate by a bonded connection.
A device for joining a conductor to a substrate, comprising:
- a positioning unit for positioning the conductor with a section to be joined;
- at least one first plasma source for generating a plasma;
- wherein the at least one first plasma source is directed onto the section to be joined for providing a first disposal of an activated connecting material to the section to be joined;
- and,
- at least one second plasma source arranged downstream to the least one first plasma source, wherein the at least one second plasma source is directed onto the section to be joined, so that a second disposal of a second connecting material is deposited onto the first disposal of the activated connecting material.
A device for joining a conductor to a substrate, comprising:
- a positioning unit for positioning the conductor with a first section to be joined;
- at least one first plasma source for generating a plasma;
- wherein the first plasma source is directed onto the first section to be joined for providing a first disposal of an activated connecting material to the first section to be joined;
- and,
- at least one second plasma source arranged downstream and at a distance to the least one first plasma source, wherein the at least one second plasma source is directed onto a second section to be joined, so that a second disposal of a second connecting material is deposited on the first disposal of the activated connecting material provided by the at least one first plasma source.
A method for joining a conductor to a substrate, comprising the steps of:
- positioning the conductor with a section to be joined on a substrate with a positioning unit;
- generating a plasma in at least one first plasma source and feeding a first connecting material into the plasma, wherein the first connecting material is activated by at least partially changing its state;
- directing a plasma jet and the activated connecting material contained therein through at least one nozzle of the at least one first plasma source onto the section to be joined;
- and,
- depositing the activated connecting material on the section to be joined, so that a first disposal of the activated connecting material joins the conductor with the substrate by a bonded connection.
A method for joining a conductor to a substrate, comprising the steps of:
- positioning the conductor with a section to be joined on a substrate by a positioning unit;
- generating a first plasma in at least one first plasma source and feeding a first connecting material into the first plasma, wherein the first connecting material is activated into a first activated connecting material by at least partially changing its state;
- directing a first plasma jet and the first activated connecting material contained therein through at least one first nozzle of the at least one first plasma source onto the section to be joined;
- generating a second plasma in at least one second plasma source and feeding a second connecting material into the second plasma, wherein the second connecting material is activated into a second activated connecting material by at least partially changing its state;
- directing a second plasma jet and the second activated connecting material contained therein through at least one second nozzle of the at least one second plasma source onto the section to be joined;
- and,
- depositing the activated connecting materials from the at least one first and second plasma sources on the section to be joined, so that a disposal of the activated connecting materials joins the conductor with the substrate by a bonded connection.
Dependencies are inferred from the claim text.