Soldering nozzle for delivering molten solder to the underside of a pcb, method of reducing the rate of occurrence of dewetting of a solder nozzle
AssigneePillarhouse International Limited
InventorAlexander J. Ciniglio
Life of this patent
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Abstract
A soldering nozzle for delivering molten solder to the underside of a PCB. The nozzle comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle of the present invention achieves an improved dewetting performance.
Claims20
A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, and the nozzle having an outer surface configured to support a return flow of molten solder, the nozzle also being adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released.
A soldering apparatus comprising a soldering unit comprising a soldering nozzle for delivering molten solder to the underside of a PCB within the soldering apparatus, the nozzle comprising a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, and the nozzle having an outer surface configured to support a return flow of molten solder, the nozzle also being adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released.
A soldering nozzle for delivering molten solder to the underside of a PCB, the nozzle comprising:
- a nozzle outlet,
- first and second stackable parts configured such that in use they will be fluidly connected to allow molten solder to be pumped therethrough to overflow the nozzle outlet, and
- an outer surface configured to support a return flow of molten solder,
- wherein the first and second stackable parts cooperate to define one or more aperture for releasing excess molten solder from the nozzle.
Dependencies are inferred from the claim text.